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2300 X 1600 X 1150 Mm Wafer Cutting Machine

2300 X 1600 X 1150 Mm Wafer Cutting Machine

Product Category :    Food Processing Machinery and Equipment

Supplier                :    R & D Engineers

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Product Profile of 2300 X 1600 X 1150 Mm Wafer Cutting Machine

R & D Engineers manufactures 2300 x 1600 x 1150 mm Wafer Cutting Machine. R & D Engineers is an ISO 9001: 2000 certified company. The 2300 x 1600 x 1150 mm [L x W x H] Wafer Cutting Machine is attached with a pneumatic pusher and an additional conveyor. The wafer books coming from the book cooler and they are fed to the cutting machine through intermediate conveyor where in first the pneumatic pusher allows the wafer book to feed them at first cut and simultaneously a gentle press is applied for a gentle press required for the stack wafer books at the process of cutting.

Specifications of 42] 2300 x 1600 x 1150 mm Wafer Cutting Machine is:

  • Machine Variables: WC4
  • Size of plate [in mm]: 470 x 350
  • Stack height [in mm]: 70
  • Minimum cutting width [in mm]: 16
  • Cutting wire [spring steel] [in mm]: 0.5
  • Connected Load [in kw]: 1.5
  • Net Weight [in kg] [approx]: 310
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